"ROK’s Recent Development on Nanotechnology Policies"

April 3 (Mon) 9:20-9:45

"Nanotechnology Foundation for Emerging Technologies"

April 3 (Mon) 09:45-10:10

"The Role of Packaging Technology for Semiconductor Industry Innovation"

April 3 (Mon) 10:30-10:55

"Environmental Implications and Impact of Semiconductor Manufacturing: Retrospective and Outlook (Virtual Presentation)"

April 3 (Mon) 10:55-11:20

"Decadal Plan for Semiconductors and Nanotechnology"

April 3 (Mon) 11:20-11:45

"To be announced"

April 3 (Mon) 12:50-13:05

"Challenges and Opportunities in Neuromorphic Computing"

April 3 (Mon) 13:05-13:20

"Device-Algorithm Co-optimization for Analog in-Memory Deep Learning"

April 3 (Mon) 13:20-13:35

"Applications of 2D Materials in Future CMOS Nodes"

April 3 (Mon) 13:35-13:50

"Extremely-Low-Power Electron Devices and Their Applications to Brain-Inspired Computing and M3D Integration"

April 3 (Mon) 13:50-14:05

"Ferroelectric Switching Kinetics in Epitaxial PMN-PT Thin Film (Virtual Presentation)"

April 3 (Mon) 14:05-14:20

"To be announced"

April 3 (Mon) 14:20-14:35

"How to Create the Values in Electronic Packaging for Semiconductor Competitiveness in Era of 4th Industrial Revolution"

April 3 (Mon) 14:45-15:00

"Additive Manufacturing of Micro and Nanoscale Electronics for Heterogenous Integration and Advanced Packaging"

April 3 (Mon) 15:00-15:15

"Advanced Packaging for Future Mobile Devices"

April 3 (Mon) 15:15-15:30

"What really is Heterogeneous Integration?"

April 3 (Mon) 15:30-15:45

"To be announced"

April 3 (Mon) 15:45-16:00

"The Future is Bright for Chips"

April 3 (Mon) 16:00-16:15

"To be announced"

April 3 (Mon) 16:15-16:30

"Environmental Implications of Semiconductor Manufacturing: Overview and NSF Funding Opportunities"

April 3 (Mon) 16:35-16:50

"Low Global Warming Gas Development for Plasma Etching Process in Semiconductor Device Fabrication"

April 3 (Mon) 16:50-17:05

"Intel’s Approach to Future Semiconductor Manufacturing while Achieving Aggressive Sustainability Goal"

April 3 (Mon) 17:05-17:20

"High-speed and sensitive measurement techniques for monitoring of carbon net-zero type semiconductor and display process"

April 3 (Mon) 17:20-17:35

"To be announced"

April 3 (Mon) 17:35-17:50

"Semiconductor etch process – a technical review in the scope of ESG"

April 3 (Mon) 17:50-18:05

"Accelerating Development and Manufacturing with AI"

April 3 (Mon) 18:05-18:20

"Technology trends for Etch patterning in the aspect of energy and environment"

April 3 (Mon) 18:20-18:35

"Reducing Slurry Consumption while Boosting Chemical Mechanical Planarization (CMP) Process Performance"

April 3 (Mon) 18:35-18:50

"Control of Electroplated Copper Layers for RDL Fabrication on PCB Substrates"

April 4 (TUE) 9:00-9:05

"Wide Bandgap Devices in Power Electronics (Virtual Presentation)"

April 4 (TUE) 9:05-9:10

"Power Delivery Network in the Advanced Packaging"

April 4 (TUE) 9:10-9:15

"Shallow Trench Isolation Chemical Mechanical Planarization: Slurry chemistry, Cleaning Chemistry, and Mechanisms"

April 4 (TUE) 9:15-9:20

"Highly Reliable Organic Non-Volatile Memory Devices Based-on Hybrid Films via iCVD Process"

April 4 (TUE) 9:20-9:25

"Millimeter-Scale Smart Sensing Semiconductor Devices for Next-Generation IoT Applications"

April 4 (TUE) 9:25-9:30

"Low Power 2D/oxide Memtransistor Device with Highly Reliable Heterosynaptic Plasticity"

April 4 (TUE) 9:30-9:35

"Advanced IC Packaging using Silicon Interconnect Fabric (Virtual Presentation)"

April 4 (TUE) 9:35-9:40

"To be announced"

April 4 (TUE) 9:40-9:45

"To be announced"

April 4 (TUE) 9:45-9:50

"To be announced"

April 4 (TUE) 9:50-9:55

"To be announced"

April 4 (TUE) 9:55-10:00